Ch.11 - Liquids, Solids & Intermolecular ForcesWorksheetSee all chapters
All Chapters
Ch.1 - Intro to General Chemistry
Ch.2 - Atoms & Elements
Ch.3 - Chemical Reactions
BONUS: Lab Techniques and Procedures
BONUS: Mathematical Operations and Functions
Ch.4 - Chemical Quantities & Aqueous Reactions
Ch.5 - Gases
Ch.6 - Thermochemistry
Ch.7 - Quantum Mechanics
Ch.8 - Periodic Properties of the Elements
Ch.9 - Bonding & Molecular Structure
Ch.10 - Molecular Shapes & Valence Bond Theory
Ch.11 - Liquids, Solids & Intermolecular Forces
Ch.12 - Solutions
Ch.13 - Chemical Kinetics
Ch.14 - Chemical Equilibrium
Ch.15 - Acid and Base Equilibrium
Ch.16 - Aqueous Equilibrium
Ch. 17 - Chemical Thermodynamics
Ch.18 - Electrochemistry
Ch.19 - Nuclear Chemistry
Ch.20 - Organic Chemistry
Ch.22 - Chemistry of the Nonmetals
Ch.23 - Transition Metals and Coordination Compounds

Solution: In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12 x 10−4 m thick. If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?

Solution: In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12 x 10−4 m thick. If 0.750% of the Si atoms are removed

Problem

In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12 x 10−4 m thick. If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?